All general discussions regarding PCB design should go here
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The BGA and CBGA packing training has been explosive in the PCB industry over the last few years because BGAs offer better first time yields to be very reliable. Also, the rising costs of assemblies and BGA components has led to the outsourcing for the rework of tin-lead BGAs. I want all your participation in this discussion and lets make the forum discussion medium more fruitful and informative to all. I am also sharing one url that help you all in getting the topic easily and make the discussion more effective.
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