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IPC Kurse
PCB-Fertigung
Herstellung & Produktion
Kabel & Verdrahtung
ESD
(Hand) Löten
Fernlehrgang
What you'll learn
  • Visual accept/reject criteria
  • Base material surface and subsurface conditions
  • Solder resist coverage over conductors and registration to lands
  • Conductor width and spacing and annular ring requirements
  • Dielectric material criteria for etchback, voids, and resin recession
  • Plated-through hole requirements for copper plating thickness, voids, nodules and cracks
  • Acceptance criteria for flexible, rigid-flex and metal core printed boards

CERTIFICATION IPC-A-600 CERTIFIED IPC SPECIALIST (CIS)

Acceptability of Printed Boards for Application...
What you'll learn
  • Visual accept/reject criteria
  • Base material surface and subsurface conditions
  • Solder resist coverage over conductors and registration to lands
  • Conductor width and spacing and annular ring requirements
  • Dielectric material criteria for etchback, voids, and resin recession
  • Plated-through hole requirements for copper plating thickness, voids, nodules and cracks
  • Acceptance criteria for flexible, rigid-flex and metal core printed boards
  • Skills for teaching the lesson plan effectively

CERTIFICATION IPC-A-600 CERTIFIED IPC TRAINER (CIT)

Acceptability of Printed Boards for...
What you'll learn
  • Visual accept/reject criteria
  • Base material surface and subsurface conditions
  • Solder resist coverage over conductors and registration to lands
  • Conductor width and spacing and annular ring requirements
  • Dielectric material criteria for etchback, voids, and resin recession
  • Plated-through hole requirements for copper plating thickness, voids, nodules and cracks
  • Acceptance criteria for flexible, rigid-flex and metal core printed boards

CERTIFICATION IPC-A-600 CERTIFIED STANDARD EXPERT (CSE)

Acceptability of Printed Boards for Standard Experts and Senior Standard...
What you'll learn
  • Visual accept/reject criteria
  • Base material surface and subsurface conditions
  • Solder resist coverage over conductors and registration to lands
  • Conductor width and spacing and annular ring requirements
  • Dielectric material criteria for etchback, voids, and resin recession
  • Plated-through hole requirements for copper plating thickness, voids, nodules and cracks
  • Acceptance criteria for flexible, rigid-flex and metal core printed boards

RECERTIFICATION IPC-A-600 CERTIFIED IPC SPECIALIST (CIS)

Acceptability of Printed Boards for Application...
What you'll learn
  • Visual accept/reject criteria
  • Base material surface and subsurface conditions
  • Solder resist coverage over conductors and registration to lands
  • Conductor width and spacing and annular ring requirements
  • Dielectric material criteria for etchback, voids, and resin recession
  • Plated-through hole requirements for copper plating thickness, voids, nodules and cracks
  • Acceptance criteria for flexible, rigid-flex and metal core printed boards
  • Skills for teaching the lesson plan effectively

RECERTIFICATION IPC-A-600 CERTIFIED IPC TRAINER (CIT)

Acceptability of Printed Boards for...
What you'll learn
  • Visual accept/reject criteria
  • Base material surface and subsurface conditions
  • Solder resist coverage over conductors and registration to lands
  • Conductor width and spacing and annular ring requirements
  • Dielectric material criteria for etchback, voids, and resin recession
  • Plated-through hole requirements for copper plating thickness, voids, nodules and cracks
  • Acceptance criteria for flexible, rigid-flex and metal core printed boards

RECERTIFICATION IPC-A-600 CERTIFIED STANDARD EXPERT (CSE)

Acceptability of Printed Boards for Standard Experts and Senior Standard...
What you'll learn
  • Product classifications, skill levels, tools and materials
  • Basic surface mount and through hole component removal
  • Land preparation and component installation
  • Primary heating methods: conductive, convective and others
  • Handling electronic assemblies
  • Wire splicing procedures
  • Through hole component removal and installation
  • Chip and MELF rework procedures
  • SOIC/SOT, J-lead and QFP rework
  • Printed wiring board circuit and laminate repair
  • Conformal coating removal

CERTIFICATION IPC 7711/7721 CERTIFIED IPC SPECIALIST (CIS)

Rework, Modify and Repair Electronic Assemblies for Application...
What you'll learn
  • Product classifications, skill levels, tools and materials
  • Basic surface mount and through hole component removal
  • Land preparation and component installation
  • Primary heating methods: conductive, convective and others
  • Handling electronic assemblies
  • Wire splicing procedures
  • Through hole component removal and installation
  • Chip and MELF rework procedures
  • SOIC/SOT, J-lead and QFP rework
  • Printed wiring board circuit and laminate repair
  • Conformal coating removal
  • Skills for teaching the lesson plan effectively

CERTIFICATION IPC 7711/7721 CERTIFIED IPC TRAINER (CIT)

Rework, Modify and Repair Electronic Assemblies for Certified IPC...
What you'll learn
  • Product classifications, skill levels, tools and materials
  • Basic surface mount and through hole component removal
  • Land preparation and component installation
  • Primary heating methods: conductive, convective and others
  • Handling electronic assemblies
  • Wire splicing procedures
  • Through hole component removal and installation
  • Chip and MELF rework procedures
  • SOIC/SOT, J-lead and QFP rework
  • Printed wiring board circuit and laminate repair
  • Conformal coating removal
  • Skills for teaching the lesson plan effectively

RECERTIFICATION IPC 7711/7721 CERTIFIED IPC TRAINER (CIT)

Rework, Modify and Repair Electronic Assemblies for Certified IPC...
What you'll learn
  • Reason for cleaning
  • Pro’s & Con’s
  • How clean is “Clean”?
  • No-Clean vs. Clean
  • Do we need to clean No-clean flux?
  • Types of contamination
  • Difficulties
  • Cost

Cleaning of PCB’S and PCA’S

Why Clean a Printed Circuit Board (PCB) and Assemblies (PCA)...



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