Advanced BGA/CSP/QFN Rework
Explaining step-by-step procedures for BGA,CSP and QFP removal, site preparation and replacement
Today’s rework and repair operations have become a lot more complicated. That’s because surface mount technology has gained increased popularity.
Smaller is a big advantage when it comes to making products more compact. But it makes rework and repair much more difficult. Now, it’s necessary to have excellent vision and incredible dexterity to rework these high density assemblies.
Today, there are component package styles that make it virtually impossible to perform manual rework operations. A couple of examples include ultra fine pitch leaded parts and Ball Grid Arrays, or BGAs. The rework requirements for these types of components have resulted in the development of “rework stations.” Rework stations are self-contained systems that provide controlled removal and replacement of surface mount components.
The training Advanced BGA/CSP/QFN Rework explains step-by-step procedures for BGA,CSP and fine pitch QFP removal, site preparation and replacement. Concludes with a discussion on cleaning and inspection requirements.
The following IPC standards are used during the training Advanced BGA/CSP/QFN Rework:
Certification: 2 days
Recertification: 1 day
Challenge test: not possible
Course materialsEvery participant receives a Syllabus of the Training Practice Materials
|Module 1||Introduction of BGA/CSP and QFN components Different types of circuit boards Preparing the PCB according to IPC-7711/7721 Fluxes and solder pastes Temperature profiles (according to IPC-7095 and IPC-7530) Placing of BGA/CSP/QFN (according to IPC 7711 procedure 5.7) Inspection of BGA/CSP/QFN IPC-A-610 Rework of BGA/CSP/QFN (according to IPC 7711 procedure 3.9.1) BGA reballing & deballing (according to IPC-7711) Common defects Practice||2 days|