Basic Soldering Techniques
Basic (Solder) skills for beginner/inexperienced solder technicians.
There have been significant changes in electronics assembly: from the introduction of new styles and the miniaturization of components, to the transition from tin-lead to lead free solder alloys. Some of the old methods of hand soldering just don’t work the same way they used to. This training will provide your soldering technicians with best-industry practices to master the challenges of contemporary hand soldering.
In this training we’ll be discussing the tools, materials, and hand soldering techniques that are used to attach through-hole components onto printed circuit boards – using lead free solder.
Certification: 2 days including exam
Recertification: 1 day including exam
Challenge test: 0,5 day only exam
Course materialsEach participant will receive a summary of the training. During the training, the participant will receive a copy of the 7711/21 IPC and the IPC-A-610 on loan. ETECH-training takes care of the practical materials.
|Module 1||Handling of electronics Contents of the module: - Introduction - Short explanation ESD - Procedures and rules within the EPA (According to IEC 61340) - Handling of electronics (according to IPC-A-610)|
|Module 2||Working with guidelines Content of the module: - General information about the use of guidelines - Explanation IEC, UL and IPC guidelines - Product class selection (according to IPC-A-610) - Terms and definitions according to IPC - Inspection (according to IPC-A-610) - Working with the IPC handbooks|
|Module 3||Theory module: Through-hole Content of the module: - General Soldering explanation (Wetting, heat transfer, Inter Metallic layers) - Why do we use Flux - Treating the Flux according to J-STD-004 - Soldering alloys tin/lead and lead-free according to J-STD-006 - Care and maintenance soldering - Checking axial components according to IPC-A-610 - Checking radial components according to IPC-A-610 - Checking DIP / SIP components according to IPC-A-610|
|Module 4||Practice module: Through-hole soldering Content of the module: - Through-hole desoldering components by vacuum - Desoldering of radial components - Desoldering of axial components - Desoldering DIL components - Cleaning the PCB (Cleaning) according to IPC 7711 procedure 2.2 - Soldering axial Through-hole components - Soldering Radial Through-hole components - Soldering DIL components - Check all solder joints and placement in accordance with IPC-A-610 and IPC-7711|
|Module 5||Jumper wires (according to IPC-7721 procedure 6.1) Content of the module: - General explanation of modifications in accordance with IPC-7721 - Preparation of the board for making modifications - Choosing the proper modification wire - Preparation of the wire - Routing of the wire - Securing the wire (bonding) - What modifications are allowed? - Practice|