Advanced Soldering Techniques (SMD)
(Soldering) Skills for advanced soldering technicians
Are your soldering technicians up on the latest techniques — for the latest components?
The training advanced soldering techniques (SMD) teaches your (solder) technicians how to solder SMD components on a circuit board in a safely and responsibly way with the challenges of contemporary hand soldering.
The training alternates theory with practical and vice versa. During the training one gets more tips and tricks to keep soldering better under control. Furthermore, there is the possibility to go into practical problems and to look for alternative solutions.
There have been significant changes in electronics assembly: from the introduction of new styles and the miniaturization of components, to the transition from tin-lead to lead free solder alloys. Some of the old methods of hand soldering just don’t work the same way they used to. This training will provide your soldering technicians with best-industry practices to master the challenges of contemporary hand soldering.
During the training we teach your (soldering) technicians the latest tricks of the trade to make rework faster and to help avoid damage to your assemblies.
ETECH-training takes care of the following practice material:
– Soldering equipment
– Solder (Leadfree)
– Tweezers, wire cutter, wire stripper, Orange stick etc.
– Magnifying lamp of microscope
– PCB (populated printed circuit board)
– 1206 resistance
– 0805 Capacitor
– 0603 Capacitor
– SOIC 14
– 1206 MELF Diode
– SOT 23
– PLCC 28
– LQFP44-T30 (10×10)
– LQFP100-T20 (14×14)
Certification: 2 days including exam
Recertification: 1 day including exam
Challenge test: 0,5 day only exam
Course materialsEach participant will receive a summary of the training. During the training, the participant will receive a copy of the 7711/21 IPC and the IPC-A-610 on loan. ETECH-training takes care of the practical materials.
|Module 1||Handling of electronics Contents of the module: - Introduction - Short explanation ESD - Procedures and rules within the EPA (According to IEC 61340) - Handling of electronics (according to IPC-A-610)|
|Module 2||Working with guidelines Content of the module: - General information about the use of guidelines - Explanation IEC, UL and IPC guidelines - Product class selection (according to IPC-A-610) - Terms and definitions according to IPC - Inspection (according to IPC-A-610) - Working with the IPC handbooks|
|Module 3||Surface Mount Technology Content of the module: - Explanation removing Chip components using the Bifurcated tip method 3.3.1; Tweezer method 3.3.2 - Explanation of mounting chip components using the point to point method 5.3.2 - Explanation remove gull wing components (2 sided) using the Bridge Fill method 3.6.1; Solder Wrap Method 3.6.2; Flux Application Method 3.6.3 - Explanation remove gull wing components (four sides) using the Bridge Fill Method 220.127.116.11; Solder Wrap Method 18.104.22.168; Flux Application Method 22.214.171.124 - Explanation of installing gull wing components using the Multi-Lead method - Top Of Lead 5.5.1 - Explanation remove J-lead components using the Bridge Fill Method 126.96.36.199; Solder Wrap Method 188.8.131.52 - Installing J-lead components using the multi-Lead method 5.6.4 - Checking SMD components according to IPC-A-610|
|Module 4||Practical module: Surface Mount Technology Content of the module: - Removing Chip components (1206, 0805 and 0603) using the Bifurcated tip method 3.3.1; Tweezer method 3.3.2 - Soldering Chip components (1206, 0805 and 0603) using the point to point method 5.3.2 - Removal of gull wing components (SOT, SOIC, QFP) using the Bridge Fill method 3.6.1; Solder Wrap Method 3.6.2; Flux Application Method 3.6.3; Bridge Fill Method 184.108.40.206; Solder Wrap Method 220.127.116.11; Flux Application Method 18.104.22.168 - Soldering Gull Wing components (SOT, SOIC, QFP) using the Multi-Lead method - Top Of Lead 5.5.1 - Removal of J-lead components (PLCC) using the Bridge Fill Method 22.214.171.124; Solder Wrap Method 126.96.36.199 - Soldering J-lead components (PLCC) using the Multi-Lead method 5.6.4 - Check all solder joints and placement in accordance with IPC-A-610 and IPC-7711 - Removal of closures (solder bridges)|
|Module 5||Jumper wires (according to IPC-7721 procedure 6.1) Content of the module: - General explanation of modifications in accordance with IPC-7721 - Preparation of the board for making modifications - Choosing the proper modification wire - Preparation of the wire - Routing of the wire - Securing the wire (bonding) - What modifications are allowed? - Practice|