Repair and Modification of PCBA’s
Repair and Modification of Assembled Printed Circuit Boards
This program is designed to teach a series of basic repair techniques for damaged electronic assemblies.
The decision whether or not to repair damaged printed circuit board assemblies usually comes down to economic considerations. The cost of repairing a board is weighed against the cost of the board; the cost of components already in place at the time damage was sustained; the cost of labor up to the time of damage; cost of overhead; and so forth.
For the purposes of this program, we will assume that a determination has been made to make a repair. To get the most from this program, you should have a working knowledge of the electronic assembly process; workplace safety; proper use and handling of chemicals, cleaners and solvents; clothing requirements; ESD protective procedures; and soldering basics, including the use of flux and flux cleaners.
Let’s begin by understanding that all repairs have three sections:
- Analysis — where the extent of damage and a course of action is determined;
- The actual work of the repair process you have decided to use;
- Three is evaluation and testing of the repair once you have finished.
Each of these three sections have a number of individual process steps that we will explain in detail during the training cours.
Certification: 2 days including exam
Recertification: 1 days including exam
Challenge test: 0,5 days only exam
Course materialsEach participant will receive a summary of the training. During the training, the participant will receive a copy of the 7711/21 IPC and the IPC-A-610 on loan. ETECH-training takes care of the practical materials.
|Module 1||Base material Repair Contents of the module: - Explanation/practice delamination/Blister Repair, Injection Method according to IPC 7721 - Explanation/practice Bow and Twist Repair according to IPC 7721 - Explanation/practice Hole Repair, Epoxy Method according to IPC 7721 - Explanation/Practice Base Material Repair, Epoxy Method according to IPC 7721|
|Module 2||Conductor Repair Content of the module: - Explanation/practice Lifted Conductor Repair, Epoxy Seal Method according to IPC 7721 - Explanation/practice Conductor Repair, Foil Jumper, Epoxy Method according to IPC 7721 - Explanation/practice Conductor Repair, Surface Wire Method according to IPC 7721 - Explanation/practice Conductor Cut, Surface Semiconductors according to IPC 7721|
|Module 3||Land Repair Contents of the module - Explanation/practice Lifted Land Repair, Epoxy Method according to IPC 7721 - Explanation/practice Land Repair, Epoxy Method according to IPC 7721 - Explanation/practice Surface Mount Pad Repair, Epoxy Method according to IPC 7721|
|Module 4||Plated Hole Repair Content of the module: - Explanation/practice Plated Hole Repair, No Inner Layer Connection according to IPC 7721|
|Module 5||Jumper wires (according to IPC-7721 procedure 6.1) Content of the module: - General explanation of modifications in accordance with IPC-7721 - Preparation of the board for making modifications - Choosing the proper modification wire - Preparation of the wire - Routing of the wire - Securing the wire (bonding) - What modifications are allowed? - Practice|