Rework of plated Through-hole (PTH) Assemblies (basic)
Basic (rework) skills for beginner/inexperienced solder technicians.
At the start of the training Rework of Plated Through-Hole (PTH) Assemblies (basic), we first emphasize the importance of avoiding unnecessary rework and we show how a cosmetic solution can cause more problems than it solves.
If the conclusion is that Rework is unavoidable, we will introduce the participants to various examples of Rework procedures approved by the industry. During training Rework of Plated Through-Hole (PTH) Assemblies (basic) the following topics are covered: vacuum extraction, (partial) bent and unbent DIP leads and auxiliary heating techniques for large thermal mass surfaces etc.
We also look into the details of anomalies such as solder defects, solder bridges, solder projections, and excess/insufficient solder.
ETECH-training will ensure the following practice material:
– Soldering equipment
– Solder (Leadfree)
– Tweezers, wire cutter, wire stripper, Orange stick etc.
– Magnifying lamp or microscope
– PCB (populated printed circuit board)
– Resistors 1/4 watt
– DIP/SIP components 14 Pin
– Capacitors with spacer
– Transistors with spacer
Certification: 2 days including exam
Recertification: 1 day including exam
Challenge test: 0,5 only exam
Course materialsEach participant will receive a summary of the training. During the training, the participant will receive a copy of the 7711/21 IPC and the IPC-A-610 on loan. ETECH-training takes care of the practical materials.
|Module 1||Handling of electronics Contents of the module: - Introduction - Short explanation ESD - Procedures and rules within the EPA (According to IEC 61340) - Handling of electronics (according to IPC-A-610)|
|Module 2||Working with guidelines Content of the module: - General information about the use of guidelines - Explanation IEC, UL and IPC guidelines - Product class selection (according to IPC-A-610) - Terms and definitions according to IPC - Inspection (according to IPC-A-610) - Working with the IPC handbooks|
|Module 3||Theory module: Through-hole Content of the module: - General Soldering explanation (Wetting, heat transfer, Inter Metallic layers) - Why do we use Flux - Treating the Flux according to J-STD-004 - Soldering alloys tin/lead and lead-free according to J-STD-006 - Care and maintenance soldering - Checking axial components according to IPC-A-610 - Checking radial components according to IPC-A-610 - Checking DIP / SIP components according to IPC-A-610|
|Module 4||Practice module: Through-hole soldering Content of the module: - Through-hole desoldering components by vacuum - Desoldering of radial components - Desoldering of axial components - Desoldering DIL components - Cleaning the PCB (Cleaning) according to IPC 7711 procedure 2.2 - Soldering axial Through-hole components - Soldering Radial Through-hole components - Soldering DIL components - Check all solder joints and placement in accordance with IPC-A-610 and IPC-7711|