Rework of Surface Mount (SMD) Assemblies (Advanced)
(Rework) Skills for advanced soldering technicians.
At the start of the training Rework of Surface Mount (SMD) Assemblies (Advanced), we first emphasize the importance of avoiding unnecessary rework and we show how a cosmetic solution can cause more problems than it solves.
If the conclusion is that Rework is unavoidable, we will introduce the participants to various examples of Rework procedures approved by the industry. During the training Rework of Surface Mount (SMD) Assemblies (Advanced), we begin with a short explanation of the individual components. After that theory and practice alternate. To make the training as realistic as possible, at the beginning of training, participants receive a fully assembled circuit board.
For the practical skills the participants must first remove various SMD components and then install a new component in the same place.
During the training among other things the following topics are covered; Damage to components, the printed circuit board (PCB), adjacent solder joints, the use of flux and flux residues, cleaning (pre- and post-), pre-heating, etc. Furthermore, we will discuss Rework Guidelines (IPC 7711) and learn basic acceptance criteria (IPC-A-610) for visuall inspection of the solder joints and the PCB.
ETECH-training takes care of the following practice material:
– Soldering equipment
– Solder (Leadfree)
– Tweezers, wire cutter, wire stripper, Orange stick etc.
– Magnifying lamp of microscope
– PCB (populated printed circuit board)
– 1206 resistance
– 0805 Capacitor
– 0603 Capacitor
– SOIC 14
– 1206 MELF Diode
– SOT 23
– PLCC 28
– LQFP44-T30 (10×10)
– LQFP100-T20 (14×14)
Certification: 2 days including exam
Recertification: 1 day including exam
Challenge test: 0,5 day only exam
Course materialsEach participant will receive a summary of the training. During the training, the participant will receive a copy of the 7711/21 IPC and the IPC-A-610 on loan. ETECH-training takes care of the practical materials.
|Module 1||Handling of electronics Contents of the module: - Introduction - Short explanation ESD - Procedures and rules within the EPA (According to IEC 61340) - Handling of electronics (according to IPC-A-610)|
|Module 2||Working with guidelines Content of the module: - General information about the use of guidelines - Explanation IEC, UL and IPC guidelines - Product class selection (according to IPC-A-610) - Terms and definitions according to IPC - Inspection (according to IPC-A-610) - Working with the IPC handbooks|
|Module 3||Surface Mount Technology Content of the module: - Explanation removing Chip components using the Bifurcated tip method 3.3.1; Tweezer method 3.3.2 - Explanation of mounting chip components using the point to point method 5.3.2 - Explanation remove gull wing components (2 sided) using the Bridge Fill method 3.6.1; Solder Wrap Method 3.6.2; Flux Application Method 3.6.3 - Explanation remove gull wing components (four sides) using the Bridge Fill Method 220.127.116.11; Solder Wrap Method 18.104.22.168; Flux Application Method 22.214.171.124 - Explanation of installing gull wing components using the Multi-Lead method - Top Of Lead 5.5.1 - Explanation remove J-lead components using the Bridge Fill Method 126.96.36.199; Solder Wrap Method 188.8.131.52 - Installing J-lead components using the multi-Lead method 5.6.4 - Checking SMD components according to IPC-A-610|
|Module 4||Practical module: Surface Mount Technology Content of the module: - Removing Chip components (1206, 0805 and 0603) using the Bifurcated tip method 3.3.1; Tweezer method 3.3.2 - Soldering Chip components (1206, 0805 and 0603) using the point to point method 5.3.2 - Removal of gull wing components (SOT, SOIC, QFP) using the Bridge Fill method 3.6.1; Solder Wrap Method 3.6.2; Flux Application Method 3.6.3; Bridge Fill Method 184.108.40.206; Solder Wrap Method 220.127.116.11; Flux Application Method 18.104.22.168 - Soldering Gull Wing components (SOT, SOIC, QFP) using the Multi-Lead method - Top Of Lead 5.5.1 - Removal of J-lead components (PLCC) using the Bridge Fill Method 22.214.171.124; Solder Wrap Method 126.96.36.199 - Soldering J-lead components (PLCC) using the Multi-Lead method 5.6.4 - Check all solder joints and placement in accordance with IPC-A-610 and IPC-7711 - Removal of closures (solder bridges)|