ETECH’s Inspection services will help protect your brand and your company’s reputation by minimizing defective merchandise, customer complaints, non-compliant products, and late shipments.
It is imperative that manufacturers verify that the products manufactured, shipped and distributed under their brand name meet industry, government regulations or their own specific requirements. As an independent, third party inspection and testing company, ETECH can conduct a variety of inspections to ensure that your brand, reputation and consumers are protected.
To help our customers to provide only the highest quality of products, ETECH offers a wide range of inspection services for printed circuit boards, printed circuit assemblies, cable & wire harnesses and practically any other electronic assemblies. Our in-depth inspections are based around industry accepted practices and standards combined with extensive experience with product reliability and potential sources of defects, providing the most complete data possible about your product and its construction.
For inspections, ETECH recommends the international inspection standard ANSI Z.1.4-2003 (ANSI Sampling Table) to determine the number of units that will be randomly selected for evaluation and the IPC standards for visual inspections. Samples are checked against a detailed inspection plan for appearance, applicable functionality, packaging integrity, workmanship, and your specific requirements. Discovered defects are classified as major, minor, or critical depending on inspection plans. If you have your QC standard and procedure, we have no concern to follow your documentation.
Inspection services reports and results with digital photos will be emailed to you within 24 hours so that you can quickly authorize your suppliers to ship your products.
ETECH has an international reputation for providing independent third-party inspection and testing services. However, our services do not stop with inspection. ETECH can provide you solutions to your entire supply chain from the sourcing, manufacturing to final delivery.
Rely on our electrics and electronics inspection & testing expertise to secure your brand image and consumer loyalty.
ETECH inspects first-article samples prior to volume production. This verifies that product specifications are being met and avoids unnecessary reengineering work later. If necessary, we can provide the factory with the technical advice necessary to improve product quality and to minimize the chance of defects during production.
These on-site inspections evaluate samples of your products selected during the manufacturing process. This confirms the quality of your product and allows any necessary changes to be addressed early on, reducing rework time and costs.
Final Random Inspections can begin only after production has been completed and all merchandise is ready and packed for shipment. Through a statistical method set by industry standards, we will sample products to verify product safety, quantity, workmanship, function, color, size, packing, and more. This ensures that your product is consistent and compliant with all country, industry, or otherwise-specified requirements and that no critical major or minor defects appear.
During a pre-shipment inspection, our engineers verify that finished goods conform to your specifications.
ETECH ensures that proper methods are employed during product loading, and we verify counts on-site.
IPC-A-600 – Acceptability of Printed Boards describes visual inspection conditions that are either externally or internally observable on printed boards.
An examination/inspection of bare printed circuit boards (PCBs) consists of the visual interpretation of the conformity/compliance with the minimum requirements described in the various specifications of the printed circuit boards, such as for example; customer-specific criteria, IPC-6010, J-STD-003, IPC-A-600 etc.
IPC-A-610 – Acceptability of Electronic Assemblies describes acceptance requirements of electrical and electronic assemblies.
An examination/inspection of assembled printed circuit boards (PCAs) consists of the visual interpretation of the conformity/compliance with the minimum requirements described in the various
specifications of the printed circuit boards, such as for example; customer-specific criteria, IPC-A-610, J-STD-001, etc.
IPC/WHMA-A-620 – Requirements and Acceptance for Cable and Wire Harness Assemblies prescribes practices and requirements for the manufacture of cable, wire and harness assemblies.
An examination/inspection of cable, wire and harness assemblies consists of the visual interpretation of the conformity/compliance with the minimum requirements described in the various specifications of the cable, wire and harness assemblies, such as for example; customer-specific criteria, IPC/WHMA-A-620, etc
Inspection requires agreement on the Class to which the products belongs.
Class 1 – General Electronic Products
Class 2 – Dedicated Service Electronic Products
Class 3 – High Performance/Harsh Environment Electronic Products
All INSPECTIONS ARE DONE BY A CERTIFIED IPC TRAINER (CIT) AND/OR MASTER IPC TRAINER (MIT)
All our staff have many years of experience working with and training inspectors, quality engineers etc. according to IPC standards in all IPC Classes. Licensed IPC Training Centers and their staff (MITs, and CITs) are periodically audit to ensure compliance with IPC Policies and Procedures.
The use of infrared thermography in electronics and electrical industry allows contactless measurement of surface temperatures with an infrared camera without contacting temperature sensors. It is an elegant, non-invasive optical temperature measurement method for simultaneous and temporally high-resolution detection of a number of measurement points.
The thermographic inspection of electronic components and assemblies is an established test procedure for failure detection and quality management – from the development of first prototypes to serial production. This enables, for example, the following to be detected:
· Hotspots and atypical temperature distributions on the surface of printed circuit boards, integrated circuits and multichip modules
· Increased contact resistances
· Increased resistance due to constriction of wires
· Hidden cracks in joints
· Power losses due to RF mismatch
· Incorrect thermal connections of heat sinks
· Short circuits, soldering defects such as cold solder joints
Thermographic analysis during each development step provides important conclusions for the optimisation of heat management and the design of complex electronic assemblies. In electronics production thermographic temperature measurement is used as a versatile instrument for quality assurance. High-performance thermography has become indispensable for setting critical technological parameters and their permanent monitoring as well as for inline testing of products in the production process and their final functional test.