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IPC courses
IPC-A-600
J-STD-001
IPC-A-610
IPC/WHMA-A-620
IPC 7711/7721
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What you'll learn
  • Visual accept/reject criteria
  • Base material surface and subsurface conditions
  • Solder resist coverage over conductors and registration to lands
  • Conductor width and spacing and annular ring requirements
  • Dielectric material criteria for etchback, voids, and resin recession
  • Plated-through hole requirements for copper plating thickness, voids, nodules and cracks
  • Acceptance criteria for flexible, rigid-flex and metal core printed boards

RECERTIFICATION IPC-A-600 CERTIFIED STANDARD EXPERT (CSE)

Acceptability of Printed Boards for Standard Experts and Senior Standard...
What you'll learn
  • General requirements, such as safety, tools and electrostatic discharge (ESD)
  • Wire and terminal assembly requirements, demonstrations and laboratory
  • Through hole technology requirements, demonstrations and laboratory
  • Surface mount technology requirements, demonstrations and laboratory
  • General soldered connection acceptance requirements (including Lead Free)
  • Machine and reflow soldering process requirements
  • Test methods and related standards
  • Using statistical process control methodology
  • Instructional skills and the roles and responsibilities of Certified IPC Trainers

RECERTIFICATION IPC J-STD-001 CERTIFIED IPC TRAINER (CIT)

Requirements for Soldered Electrical and Electronic Assemblies for Certified IPC...
What you'll learn
  • Visual accept/reject criteria
  • Purpose and application of IPC-A-610
  • Hardware installation
  • Soldering criteria, including lead free connections
  • Soldered connection requirements for plated-through holes
  • Solder fillet dimensional criteria for all major SMT component groups
  • Component mounting criteria for DIPS, socket pins and card edge connectors
  • Jumper wire assembly requirements

RECERTIFICATION IPC-A-610 CERTIFIED IPC SPECIALIST (CIS)

Acceptability of Electronic Assemblies for Application...
What you'll learn
  • Establishing and maintaining integrity of the certification program
  • Purpose and application of IPC-A-610
  • Hardware installation
  • Soldering criteria, including lead free connections
  • Soldered connection requirements for plated-through holes
  • Solder fillet dimensional criteria for all major SMT component groups
  • Component mounting criteria for DIPS, socket pins and card edge connectors
  • Jumper wire assembly requirements

RECERTIFICATION IPC-A-610 CERTIFIED STANDARD EXPERT (CSE)

Acceptability of Electronic Assemblies for Standard Experts and Senior Standard...
What you'll learn
  • Visual accept/reject criteria
  • Base material surface and subsurface conditions
  • Solder resist coverage over conductors and registration to lands
  • Conductor width and spacing and annular ring requirements
  • Dielectric material criteria for etchback, voids, and resin recession
  • Plated-through hole requirements for copper plating thickness, voids, nodules and cracks
  • Acceptance criteria for flexible, rigid-flex and metal core printed boards

CERTIFICATION IPC-A-600 CERTIFIED IPC SPECIALIST (CIS)

Acceptability of Printed Boards for Application...
What you'll learn
  • Establishing and maintaining integrity of the certification program
  • Purpose and application of IPC-A-610
  • Hardware installation
  • Soldering criteria, including lead free connections
  • Soldered connection requirements for plated-through holes
  • Solder fillet dimensional criteria for all major SMT component groups
  • Component mounting criteria for DIPS, socket pins and card edge connectors
  • Jumper wire assembly requirements
  • Skills for teaching the lesson plan effectively

RECERTIFICATION IPC-A-610 CERTIFIED IPC TRAINER (CIT)

Acceptability of Electronic Assemblies for...
What you'll learn
  • Visual accept/reject criteria
  • Base material surface and subsurface conditions
  • Solder resist coverage over conductors and registration to lands
  • Conductor width and spacing and annular ring requirements
  • Dielectric material criteria for etchback, voids, and resin recession
  • Plated-through hole requirements for copper plating thickness, voids, nodules and cracks
  • Acceptance criteria for flexible, rigid-flex and metal core printed boards
  • Skills for teaching the lesson plan effectively

CERTIFICATION IPC-A-600 CERTIFIED IPC TRAINER (CIT)

Acceptability of Printed Boards for...
What you'll learn
  • Measure and cut wire/cables, strip, and tin wires.
    • Assemble and solder terminals, crimp formed contacts (insulated and non-insulated), crimp stamped/machine contacts.
    • Assemble BNC connectors to coaxial cable, RJ45 plugs, and ribbon cable.
    • Bundle wires and cables using tie wraps, spot ties and continuous lacing
  • Documentation and tutorials will be provided.

RECERTIFICATION IPC/WHMA-A-620 CIT HANDS-ON

The IPC-A-620C optional hands-on training for Certified IPC...
What you'll learn
  • Visual accept/reject criteria
  • Base material surface and subsurface conditions
  • Solder resist coverage over conductors and registration to lands
  • Conductor width and spacing and annular ring requirements
  • Dielectric material criteria for etchback, voids, and resin recession
  • Plated-through hole requirements for copper plating thickness, voids, nodules and cracks
  • Acceptance criteria for flexible, rigid-flex and metal core printed boards

CERTIFICATION IPC-A-600 CERTIFIED STANDARD EXPERT (CSE)

Acceptability of Printed Boards for Standard Experts and Senior Standard...
What you'll learn
  • Measure and cut wire/cables, strip, and tin wires.
    • Assemble and solder terminals, crimp formed contacts (insulated and non-insulated), crimp stamped/machine contacts.
    • Assemble BNC connectors to coaxial cable, RJ45 plugs, and ribbon cable.
    • Bundle wires and cables using tie wraps, spot ties and continuous lacing
  • Documentation and tutorials will be provided.

RECERTIFICATION IPC/WHMA-A-620 CIS HANDS-ON

The IPC-A-620C optional hands-on training for Application...
What you'll learn
  • Visual accept/reject criteria
  • Purpose and application of IPC-A-610
  • Hardware installation
  • Soldering criteria, including lead free connections
  • Soldered connection requirements for plated-through holes
  • Solder fillet dimensional criteria for all major SMT component groups
  • Component mounting criteria for DIPS, socket pins and card edge connectors
  • Jumper wire assembly requirements

CERTIFICATION IPC-A-610 CERTIFIED IPC SPECIALIST (CIS)

Acceptability of Electronic Assemblies for Application...
What you'll learn
  • Cable and wire dimensioning, tolerances and preparation
  • Crimp terminations: Stamped and formed contacts and Machined Contacts
  • Soldered terminations
  • Splices
  • Connectorization
  • Molding and potting
  • Marking and labeling
  • Co-ax and twin-ax assembly
  • Wire bundle securing
  • Shielding
  • Testing of Cable/Wire Harness Assemblies

RECERTIFICATION IPC/WHMA-A-620 CERTIFIED STANDARD EXPERT (CSE)

Requirements and Acceptance for Cable and Wire Harness Assemblies for Standard Experts and Senior...
What you'll learn
  • Establishing and maintaining integrity of the certification program
  • Purpose and application of IPC-A-610
  • Hardware installation
  • Soldering criteria, including lead free connections
  • Soldered connection requirements for plated-through holes
  • Solder fillet dimensional criteria for all major SMT component groups
  • Component mounting criteria for DIPS, socket pins and card edge connectors
  • Jumper wire assembly requirements
  • Skills for teaching the lesson plan effectively

CERTIFICATION IPC-A-610 CERTIFIED IPC TRAINER (CIT)

Acceptability of Electronic Assemblies for...
What you'll learn
  • Product classifications, skill levels, tools and materials
  • Basic surface mount and through hole component removal
  • Land preparation and component installation
  • Primary heating methods: conductive, convective and others
  • Handling electronic assemblies
  • Wire splicing procedures
  • Through hole component removal and installation
  • Chip and MELF rework procedures
  • SOIC/SOT, J-lead and QFP rework
  • Printed wiring board circuit and laminate repair
  • Conformal coating removal

CERTIFICATION IPC 7711/7721 CERTIFIED IPC SPECIALIST (CIS)

Rework, Modify and Repair Electronic Assemblies for Application...
What you'll learn
  • Establishing and maintaining integrity of the certification program
  • Purpose and application of IPC-A-610
  • Hardware installation
  • Soldering criteria, including lead free connections
  • Soldered connection requirements for plated-through holes
  • Solder fillet dimensional criteria for all major SMT component groups
  • Component mounting criteria for DIPS, socket pins and card edge connectors
  • Jumper wire assembly requirements

CERTIFICATION IPC-A-610 CERTIFIED STANDARD EXPERT (CSE)

Acceptability of Electronic Assemblies for Standard Experts and Senior Standard...
What you'll learn
  • Product classifications, skill levels, tools and materials
  • Basic surface mount and through hole component removal
  • Land preparation and component installation
  • Primary heating methods: conductive, convective and others
  • Handling electronic assemblies
  • Wire splicing procedures
  • Through hole component removal and installation
  • Chip and MELF rework procedures
  • SOIC/SOT, J-lead and QFP rework
  • Printed wiring board circuit and laminate repair
  • Conformal coating removal

RECERTIFICATION IPC 7711/7721 CERTIFIED IPC SPECIALIST (CIS)

Rework, Modify and Repair Electronic Assemblies for Application...


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