NEW IPC-A-600K

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Just Published: IPC-A-600K, Acceptability of Printed Boards
IPC has released IPC-A-600K, Acceptability of Printed Boards, the definitive illustrated guide to printed circuit board acceptability. This companion document to IPC-6012, Qualification and Performance Specification for Rigid Printed Boards and IPC-6013, Qualification and Performance Specification for Flexible Printed Boards, provides photographs and illustrations of the target, acceptable and nonconforming conditions that are either internally or externally observable on bare printed boards.

• Updated Pattern Definitions – Conductor Width, External Annular Ring, Surface Plating
• Updated Dielectric Materials – Laminate Voids/Cracks, Smear Removal, Negative Etchback, Layer-to-Layer Spacing
• Conductive Patterns – Overhang, External Conductive Plating (Foil Plus Plating), Solder Mask Thickness
• Significant Changes to Section on Plated-Through Hole – Microvia Target Land Contact Dimension, Copper Wrap Plating, Copper Cap Plating, Plated Copper Filled Vias, Back-Drilled Holes
• Significant Changes to Metal Core Printed Boards
• Updated Solderability Testing Crazing Penetration Criteria
• Updated Changes to Acceptance for Base Material Surfaces