Just Published: IPC-A-600K, Acceptability of Printed Boards
IPC has released IPC-A-600K, Acceptability of Printed Boards, the definitive illustrated guide to printed circuit board acceptability. This companion document to IPC-6012, Qualification and Performance Specification for Rigid Printed Boards and IPC-6013, Qualification and Performance Specification for Flexible Printed Boards, provides photographs and illustrations of the target, acceptable and nonconforming conditions that are either internally or externally observable on bare printed boards.
- Updated Pattern Definitions – Conductor Width, External Annular Ring, Surface Plating
- Updated Dielectric Materials – Laminate Voids/Cracks, Smear Removal, Negative Etchback, Layer-to-Layer Spacing
- Conductive Patterns – Overhang, External Conductive Plating (Foil Plus Plating), Solder Mask Thickness
- Significant Changes to Section on Plated-Through Hole – Microvia Target Land Contact Dimension, Copper Wrap Plating, Copper Cap Plating, Plated Copper Filled Vias, Back-Drilled Holes
- Significant Changes to Metal Core Printed Boards
- Updated Solderability Testing Crazing Penetration Criteria
- Updated Changes to Acceptance for Base Material Surfaces
