Criteria for class 3 copper wrap plating effective January 1, 2018 for new designs
IPC released in October 2017, IPC-6012D-AM1, Qualification and Performance Specification for Rigid Printed Boards. This amendment brought to light the new acceptance criteria for copper wrap plating on class 3 products. The IPC
D-33a task group provided an effective date of January 1, 2018 for new designs using the criteria set aside in Amendment 1. Legacy designs would continue to use the criteria established in the original standard IPC-6012D from September 2015.
If you missed out on our original announcement you still have an opportunity to purchase the Amendment now and prepare to meet the new acceptance criteria for Class 3 copper wrap plating in your new designs.
IPC would like to thank you for your continued support in using the standards developed for the electronics industry.